T/JSSIA 0003-2017
Series Programs for Wafer Level Chip Scale Package (English Version)

Standard No.

T/JSSIA 0003-2017

Language

Chinese, Available in English version

Release Date

2017

Published By

Group Standards of the People's Republic of China

Latest

T/JSSIA 0003-2017

Scope

This standard specifies a standard package family for Wafer Level Chip Scale Packages (WLCSP), as well as guidelines for selection and application, applicable to Wafer Level Chip Scale Packages.

T/JSSIA 0003-2017 history

• 2017 T/JSSIA 0003-2017 Series Programs for Wafer Level Chip Scale Package