JIS C 6472:1995
Copper-clad laminates for flexible printed wiring boards (Polyester film, Polyimide film)

Standard No.

JIS C 6472:1995

Release Date

1995

Published By

Japanese Industrial Standards Committee (JISC)

Latest

JIS C 6472:1995

Scope

This standard specifies copper-clad laminates (using polyester film or polyimide film as a paste) (hereinafter referred to as copper-clad laminates) used in flexible printed wiring boards.

JIS C 6472:1995 history

• 1995 JIS C 6472:1995 Copper-clad laminates for flexible printed wiring boards (Polyester film, Polyimide film)