T/JSSIA 0004-2017
Outline Dimensions of Wafer Level Chip Scale Package (English Version)

Standard No.

T/JSSIA 0004-2017

Language

Chinese, Available in English version

Release Date

2017

Published By

Group Standards of the People's Republic of China

Latest

T/JSSIA 0004-2017

Scope

This standard specifies the overall dimensions of Wafer Level Chip Scale Packages (WLCSP) and is suitable for dimensional inspection of finished devices in Wafer Level Chip Scale Packages (WLCSP).

T/JSSIA 0004-2017 history

• 2017 T/JSSIA 0004-2017 Outline Dimensions of Wafer Level Chip Scale Package