T/QGCML 2655-2023
Metal substrate heat dissipation card connector (English Version)

Standard No.

T/QGCML 2655-2023

Language

Chinese, Available in English version

Release Date

2023

Published By

Group Standards of the People's Republic of China

Latest

T/QGCML 2655-2023

Scope

This document specifies the terms and definitions, composition and principles, technical requirements, test methods, inspection rules, marking, packaging, transportation and storage of metal substrate heat dissipation card connectors. This document is applicable to the production and inspection of metal substrate heat dissipation card connectors.

T/QGCML 2655-2023 history

• 2023 T/QGCML 2655-2023 Metal substrate heat dissipation card connector