BS EN IEC 61189-5-601:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Reflow soldering ability test for solder joint, and reflow heat resistance test for printed bo...

Standard No.
BS EN IEC 61189-5-601:2021
Release Date
2021
Published By
British Standards Institution (BSI)
Latest
BS EN IEC 61189-5-601:2021

BS EN IEC 61189-5-601:2021 history

  • 2021 BS EN IEC 61189-5-601:2021 Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Reflow soldering ability test for solder joint, and reflow heat resistance test for printed bo...
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Reflow soldering ability test for solder joint, and reflow heat resistance test for printed bo...



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