DB34/T 3371-2019
Method for determination of thermal conductivity of rigid copper-clad laminates for printed circuit boards (English Version)
- Standard No.
- DB34/T 3371-2019
- Language
- Chinese, Available in English version
- Release Date
- 2019
- Published By
- Anhui Provincial Standard of the People's Republic of China
- Latest
- DB34/T 3371-2019
- Scope
- This standard specifies the testing principles, specimens, measuring instruments, measuring environment, measuring procedures, result calculations and measuring reports for measuring the thermal conductivity of rigid copper-clad laminates for printed circuits (hereinafter referred to as copper-clad laminates) using the flat plate method. This standard is applicable to the determination of the thermal conductivity of copper-clad laminates with a thickness of not less than 1.00 mm, and also applies to the determination of the thermal conductivity of bare copper-clad laminates with a thickness of not less than 1.00 mm.
DB34/T 3371-2019 history
- 2019 DB34/T 3371-2019 Method for determination of thermal conductivity of rigid copper-clad laminates for printed circuit boards
