BS EN IEC 60749-20:2020
Semiconductor devices. Mechanical and climatic test methods - Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

Standard No.: BS EN IEC 60749-20:2020
Release Date: 2020
Published By: British Standards Institution (BSI)
Latest: BS EN IEC 60749-20:2020

Scope

What is BS EN IEC 60749 ‑ 20 about? BS EN IEC 60749 ‑ 20 is the 20th part of semiconductor the multi-series European standard on semiconductor devices. BS EN IEC 60749 ‑ 20 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive. BS EN IEC 60749-20:2020 history

2020 BS EN IEC 60749-20:2020 Semiconductor devices. Mechanical and climatic test methods - Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

Semiconductor devices. Mechanical and climatic test methods - Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

BS EN IEC 60749-20:2020Semiconductor devices. Mechanical and climatic test methods - Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

BS EN IEC 60749-20:2020
Semiconductor devices. Mechanical and climatic test methods - Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat