T/SZBX 018-2021
Products of Wafer Level Chip Scale Package (English Version)

Standard No.

T/SZBX 018-2021

Language

Chinese, Available in English version

Release Date

2021

Published By

Group Standards of the People's Republic of China

Latest

T/SZBX 018-2021

Scope

This document specifies the structural codes, symbol abbreviations and product outline drawings, technical requirements, detection methods, inspection rules and labeling, marking, packaging, transportation and storage of wafer-level chip size packaging products.

T/SZBX 018-2021 history

• 2021 T/SZBX 018-2021 Products of Wafer Level Chip Scale Package