T/SZBSIA 007-2022
Semiconductor die bonder test specification (English Version)
- Standard No.
- T/SZBSIA 007-2022
- Language
- Chinese, Available in English version
- Release Date
- 2022
- Published By
- Group Standards of the People's Republic of China
- Latest
- T/SZBSIA 007-2022
- Scope
- This document specifies the terms and definitions, structure and basic parameters, technical requirements, test methods, inspection rules, instructions for use and markings, packaging, transportation and storage of semiconductor die-bonding machines. This document applies to IC semiconductor die bonding machines.
T/SZBSIA 007-2022 history
- 2022 T/SZBSIA 007-2022 Semiconductor die bonder test specification
