This document specifies the testing methods for the basic physical and chemical properties, corrosion properties, electrical insulation properties, printing properties, welding properties, mechanical interconnection properties, impact on signal transmission loss and solder joint reliability of solder paste for microwave components. This document is applicable to printed solder paste. Jet printing solder paste and dispensing solder paste can be implemented with reference to this document.
T/CSTM 00921-2023 history
2023T/CSTM 00921-2023 Performance test and application verification method of solder paste for microwave assembly