T/ZSA 38-2020
Experimental method for residual stress in SiC wafers (English Version)

Standard No.

T/ZSA 38-2020

Language

Chinese, Available in English version

Release Date

2020

Published By

Group Standards of the People's Republic of China

Latest

T/ZSA 38-2020

Scope

This document specifies the optical non-destructive testing method for residual stress inside SiC wafers. This document is applicable to SiC wafers with appropriate wafer thickness and a test light transmittance of more than 30% in the visible light range of wavelength 400-700nm.

T/ZSA 38-2020 history

• 2020 T/ZSA 38-2020 Experimental method for residual stress in SiC wafers