SJ/T 11551-2015
Resin-coated copper foil for high-density interconnection printed circuits (English Version)

Standard No.

SJ/T 11551-2015

Language

Chinese, Available in English version

Release Date

2015

Published By

工业和信息化部

Latest

SJ/T 11551-2015

SJ/T 11551-2015 history

• 2015 SJ/T 11551-2015 Resin-coated copper foil for high-density interconnection printed circuits