This document refers to relevant international standards and combines the actual application needs of the industry to formulate thermal performance indicators and evaluation method standards for multi-heat source components (MCM/SiP) to solve the lack of standardized thermal performance characterization parameters and standardized testing of multi-heat source components in practical applications. Evaluation method issues. This document can be used as an important part of the thermal performance characterization and thermal performance evaluation standard system of semiconductor discrete devices and microcircuit devices.
T/CIE 118-2021 history
2021T/CIE 118-2021 Thermal performance index and evaluation method of multi-heat source module (MCM/SiP)