IEC 62047-17:2015 Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films
This part of IEC 62047 specifies the method for performing bulge tests on the free-standing film that is bulged within a window. The specimen is fabricated with micro ano structural film materials@ including metal@ ceramic and polymer films@ for MEMS@ micromachines and others. The thickness of the film is in the range of 0@1 ?? to 10 ??@ and the width of the rectangular and square membrane window and the diameter of the circular membrane range from 0@5 mm to 4 mm. The tests are carried out at ambient temperature@ by applying a uniformly-distributed pressure to the testing film specimen with bulging window. Elastic modulus and residual stress for the film materials can be determined with this method.
IEC 62047-17:2015 Referenced Document
IEC 62047-2:2006 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
IEC 62047-17:2015 history
2015IEC 62047-17:2015 Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films