IEC 62047-17:2015
Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films

Standard No.
IEC 62047-17:2015
Release Date
2015
Published By
International Electrotechnical Commission (IEC)
Latest
IEC 62047-17:2015
Replace
IEC 47F/210/FDIS:2014
Scope
This part of IEC 62047 specifies the method for performing bulge tests on the free-standing film that is bulged within a window. The specimen is fabricated with micro ano structural film materials@ including metal@ ceramic and polymer films@ for MEMS@ micromachines and others. The thickness of the film is in the range of 0@1 ?? to 10 ??@ and the width of the rectangular and square membrane window and the diameter of the circular membrane range from 0@5 mm to 4 mm. The tests are carried out at ambient temperature@ by applying a uniformly-distributed pressure to the testing film specimen with bulging window. Elastic modulus and residual stress for the film materials can be determined with this method.

IEC 62047-17:2015 Referenced Document

  • IEC 62047-2:2006 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials

IEC 62047-17:2015 history

  • 2015 IEC 62047-17:2015 Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films
Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films



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