DIN EN IEC 60749-37:2023-12
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer (IEC 60749-37:2022); German version EN IEC 60749-37:2022 / Note: DIN EN 60749-37 (2008-08) remains valid alongside this standard...

Standard No.

DIN EN IEC 60749-37:2023-12

Release Date

2023

Published By

German Institute for Standardization

Latest

DIN EN IEC 60749-37:2023-12

DIN EN IEC 60749-37:2023-12 history

• 2023 DIN EN IEC 60749-37:2023-12 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer (IEC 60749-37:2022); German version EN IEC 60749-37:2022 / Note: DIN EN 60749-37 (2008-08) remains valid alongside this standard...
• 2023 DIN EN IEC 60749-37:2023-02 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer (IEC 47/2651/CDV:2020); German and English version prEN IEC 60749-37:2020 / Note: Date of issue 2023-01-20*Intended as replaceme...
• 2023 DIN EN IEC 60749-37:2023 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer (IEC 47/2651/CDV:2020); German and English version prEN IEC 60749-37:2020