ASTM F1995-13(2021) PDF

Scope: 1.1 This test method covers the determination of the shear integrity of materials and procedures used to attach surface mount devices (SMD) to a membrane switch circuit. 1.2 This test method is typically used to indicate the sufficient cure of conductive adhesive or underfill, or both. In general, this test method should be used prior to encapsulant. This test may also be used to demonstrate the Shear Force with encapsulation. 1.3 The values stated in SI units are to be regarded as standard. No other units of measurement are included in this standard. 1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use. 1.5 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.

ASTM F1995-13(2021) history

2021 ASTM F1995-13(2021) Standard Test Method for Determining the Shear Strength of the Bond between a Surface Mount Device (SMD) and Substrate in a Membrane Switch
2013 ASTM F1995-13 Standard Test Method for Determining the Shear Strength of the Bond between a Surface Mount Device (SMD) and Substrate in a Membrane Switch
2012 ASTM F1995-12 Standard Test Method for Determining the Shear Force of a Surface Mount Device (SMD) in a Membrane Switch
2000 ASTM F1995-00(2005) Standard Test Method for Determining the Bond Strength for a Surface Mount Device (SMD) by Applying Shear Force on a Membrane Switch
2000 ASTM F1995-00 Standard Test Method for Determining the Bond Strength for a Surface Mount Device (SMD) by Applying Shear Force on a Membrane Switch