DIN EN IEC 60749-20-1:2018
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat (IEC 47/2488/CDV:2018); German and English version
- Standard No.
- DIN EN IEC 60749-20-1:2018
- Release Date
- 2018
- Published By
- German Institute for Standardization
- Status
- Replace By
- DIN EN IEC 60749-20-1:2018-11
- Latest
- DIN EN IEC 60749-20-1:2018-11
DIN EN IEC 60749-20-1:2018 history
- 2018 DIN EN IEC 60749-20-1:2018-11 Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat (IEC 47/2488/CDV:2018); German and English vers...
- 2018 DIN EN IEC 60749-20-1:2018 Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat (IEC 47/2488/CDV:2018); German and English version
