T/QGCML 1663-2023
General technical conditions for hot melt adhesives (English Version)

Standard No.

T/QGCML 1663-2023

Language

Chinese, Available in English version

Release Date

2023

Published By

Group Standards of the People's Republic of China

Latest

T/QGCML 1663-2023

Scope

This document specifies the terms and definitions, symbols, technical requirements, test methods, inspection rules, markings, packaging, storage, transportation, and instructions for use of hot melt adhesives. This document is suitable for hot melt adhesives used in wireless binding, household appliance packaging, pipe anti-corrosion and other applications.

T/QGCML 1663-2023 history

• 2023 T/QGCML 1663-2023 General technical conditions for hot melt adhesives