BS EN IEC 60749-15:2020
Semiconductor devices. Mechanical and climatic test methods - Resistance to soldering temperature for through-hole mounted devices

Standard No.: BS EN IEC 60749-15:2020
Release Date: 2020
Published By: British Standards Institution (BSI)
Latest: BS EN IEC 60749-15:2020

Scope

What is BS EN IEC 60749 ‑ 15 about? BS EN IEC 60749 ‑ 15 is the 15th part of Semiconductor devices in multi-series. BS EN IEC 60749 ‑ 15 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which BS EN IEC 60749-15:2020 history

2020 BS EN IEC 60749-15:2020 Semiconductor devices. Mechanical and climatic test methods - Resistance to soldering temperature for through-hole mounted devices

Semiconductor devices. Mechanical and climatic test methods - Resistance to soldering temperature for through-hole mounted devices

BS EN IEC 60749-15:2020Semiconductor devices. Mechanical and climatic test methods - Resistance to soldering temperature for through-hole mounted devices

BS EN IEC 60749-15:2020
Semiconductor devices. Mechanical and climatic test methods - Resistance to soldering temperature for through-hole mounted devices