IEC 62951-5:2019
Semiconductor devices - Flexible and stretchable semiconductor devices - Part 5: Test method for thermal characteristics of flexible materials
- Standard No.
- IEC 62951-5:2019
- Release Date
- 2019
- Published By
- International Electrotechnical Commission (IEC)
- Latest
- IEC 62951-5:2019
- Scope
- This part of IEC 62951 specifies the test method for thermal characteristics of flexible materials. This document includes terms@ definitions@ symbols@ and test methods that can be used to evaluate and determine thermal characteristics of flexible materials for practical use. The measurement method relies on non-contact optical thermometry that is based on temperature dependent optical reflectance. This document is applicable to both substrate and thin-film flexible semiconductor materials that are subjected to bending and stretching.
IEC 62951-5:2019 history
- 2019 IEC 62951-5:2019 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 5: Test method for thermal characteristics of flexible materials
