This standard is aimed at hybrid power modules composed of silicon IGBTs and silicon carbide diodes. It refers to GB/T29332, IEC60747-2 and BSEN60747-15, as well as the technical requirements of products from mainstream foreign power semiconductor module manufacturers, and combines the application needs of hybrid modules. Detailed provisions and requirements for device terminology, symbols, basic ratings and characteristics, and test methods. On the basis of the original innovation, this revision innovatively proposes the definition and test method of the maximum and minimum allowable operating junction temperatures, which is the first time in China.
T/IAWBS 006-2022 history
2022T/IAWBS 006-2022 Test methods for hybrid silicon carbide modules
2018T/IAWBS 006-2018 Test methods for hybrid silicon carbide modules