DB44/T 1088-2012
Test method for interlayer adhesion of copper clad laminates (English Version)
- Standard No.
- DB44/T 1088-2012
- Language
- Chinese, Available in English version
- Release Date
- 2011
- Published By
- Guangdong Provincial Standard of the People's Republic of China
- Latest
- DB44/T 1088-2012
- Scope
- This standard specifies a test method for determining the interlayer adhesion of copper-clad laminates to characterize the bonding strength between insulating layers of copper-clad laminates. This test method includes three methods: T-shaped peeling method, wedge-shaped knife edge separation method and vertical stretching method, among which the T-shaped peeling method is the arbitration method. This test method is suitable for copper-clad laminates for printed circuits using glass fiber cloth as the reinforcement system.
DB44/T 1088-2012 history
- 2011 DB44/T 1088-2012 Test method for interlayer adhesion of copper clad laminates
