This document specifies the classification, requirements, test methods, inspection rules and marking, packaging, transportation and storage of non-woven/polyurethane composite polishing pads (hereinafter referred to as polishing pads). This document is suitable for polishing pads, used for polishing silicon wafers, LCD substrates and glass panels, sapphire substrates and other materials. It can also be used for ITO conductive glass, glass substrates, photomasks and LCD masks, beryllium, fused quartz , polishing of indium phosphide, lithium niobate, lithium tantalate, stainless steel, tungsten, and expanded glass.
T/SHXCL 0004-2021 history
2021T/SHXCL 0004-2021 Nonwovens/polyurethane composite polishing pad