1. Standardize the thermal resistance range in the plane direction so that it covers the value of each node. 2. Clarify the materials used for electroplating bonding strength testing. 3. Add instructions for the horizontal and vertical thermal conductivity test methods, including environmental conditions, equipment and instrument calibration, accuracy settings, calculation formulas, etc.
T/CPCA 5041-2014 history
2014T/CPCA 5041-2014 Test methods for electronic circuit board for high-brightness LEDs