DIN EN 62047-13:2012-10
Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures (IEC 62047-13:2012); German version EN 62047-13:2012
- Standard No.
- DIN EN 62047-13:2012-10
- Release Date
- 2012
- Published By
- German Institute for Standardization
- Latest
- DIN EN 62047-13:2012-10
DIN EN 62047-13:2012-10 history
- 2012 DIN EN 62047-13:2012-10 Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures (IEC 62047-13:2012); German version EN 62047-13:2012
- 2012 DIN EN 62047-13:2012 Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures (IEC 62047-13:2012); German version EN 62047-13:2012
