IEC 62047-36:2019
Semiconductor devices – Micro-electromechanical devices – Part 36: Environmental and dielectric withstand test methods for MEMS piezoelectric thin films
- Standard No.
- IEC 62047-36:2019
- Release Date
- 2019
- Published By
- International Electrotechnical Commission (IEC)
- Latest
- IEC 62047-36:2019
- Scope
- This part of IEC 62047 specifies test methods for evaluating the durability of MEMS piezoelectric thin film materials under the environmental stress of temperature and humidity and under electrical stress@ and test conditions for appropriate quality assessment. Specifically@ this document specifies test methods and test conditions for measuring the durability of a DUT under temperature and humidity conditions and applied voltages. It further applies to evaluations of converse piezoelectric properties in piezoelectric thin films formed primarily on silicon substrates@ i.e.@ piezoelectric thin films used as actuators. This document does not cover reliability assessments@ such as methods of predicting the lifetime of a piezoelectric thin film based on a Weibull distribution.
IEC 62047-36:2019 history
- 2019 IEC 62047-36:2019 Semiconductor devices – Micro-electromechanical devices – Part 36: Environmental and dielectric withstand test methods for MEMS piezoelectric thin films
