DB34/T 3367-2019
Test method for thermal stress in plated-through holes of printed circuit boards (English Version)

Standard No.

DB34/T 3367-2019

Language

Chinese, Available in English version

Release Date

2019

Published By

Anhui Provincial Standard of the People's Republic of China

Latest

DB34/T 3367-2019

Scope

This standard specifies the equipment and reagents, test procedures, defect judgment and report for the thermal stress test method of plated holes of printed circuit boards. This standard is applicable to thermal stress testing of plated holes with metal plating in printed circuit boards.

DB34/T 3367-2019 history

• 2019 DB34/T 3367-2019 Test method for thermal stress in plated-through holes of printed circuit boards