IEC 62047-31:2017
Semiconductor devices – Micro-electromechanical devices – Part 31: Four-point bending test method for interfacial adhesion energy of layered MEMS materials (Edition 1.0)

Standard No.

IEC 62047-31:2017

Release Date

2017

Published By

IEC - International Electrotechnical Commission

Status

Be replaced 2019-04

Replace By

IEC 62047-31:2019

Latest

IEC 62047-31:2019

Scope

This part of IEC 62047 specifies measuring methods of electro-mechanical conversion characteristics of piezoelectric thin film used for micro sensors and micro actuators@ and its reporting schema to determine the characteristic parameters for consumer@ industry or any other applications of piezoelectric devices. This document applies to piezoelectric thin films fabricated by MEMS process.

IEC 62047-31:2017 history

• 2019 IEC 62047-31:2019 Semiconductor devices - Micro-electromechanical devices - Part 31: Four-point bending test method for interfacial adhesion energy of layered MEMS materials
• 2017 IEC 62047-31:2017 Semiconductor devices – Micro-electromechanical devices – Part 31: Four-point bending test method for interfacial adhesion energy of layered MEMS materials (Edition 1.0)