T/CPIA 0038-2022
Electroplated diamond wire for photovoltaic silicon wafer cutting (English Version)

Standard No.

T/CPIA 0038-2022

Language

Chinese, Available in English version

Release Date

2022

Published By

Group Standards of the People's Republic of China

Latest

T/CPIA 0038-2022

Scope

This document specifies the terms and definitions, product specifications, technical requirements, test methods, inspection rules, packaging, marking, transportation, storage and disposal of used diamond wires for photovoltaic silicon wafer cutting. This document applies to diamond wires for cutting photovoltaic monocrystalline silicon and polycrystalline silicon wafers.

T/CPIA 0038-2022 history

• 2022 T/CPIA 0038-2022 Electroplated diamond wire for photovoltaic silicon wafer cutting