T/ZZB 0594-2018
Electroplated diamond wire for silicon chips (English Version)
- Standard No.
- T/ZZB 0594-2018
- Language
- Chinese, Available in English version
- Release Date
- 2018
- Published By
- Group Standards of the People's Republic of China
- Latest
- T/ZZB 0594-2018
- Scope
- This standard specifies the terms and definitions, product specifications, basic requirements, technical requirements, test methods, inspection rules, marking, packaging, transportation, storage and quality commitment of diamond cutting wire for silicon wafers. This standard applies to electroplated diamond cutting wires (hereinafter referred to as diamond cutting wires) for silicon wafers with nominal diameters of 0.065 mm, 0.060 mm, and 0.055 mm.
T/ZZB 0594-2018 history
- 2018 T/ZZB 0594-2018 Electroplated diamond wire for silicon chips
