BS IEC 62047-31:2019 PDF

Standard No.: BS IEC 62047-31:2019
Release Date: 2019
Published By: British Standards Institution (BSI)
Latest: BS IEC 62047-31:2019

Scope: What is BS IEC 62047 ‑ 31 - Micro-electromechanical systems (MEMS) materials about ? BS IEC 62047 ‑ 31 is the 31st part of an international standard used for semiconductor devices that specifies the bending test method. This test method helps in measuring the interfacial adhesion energy in microelectromechanical devices. BS IEC 62047-31 is a four-point bending test method for interfacial adhesion energy of layered MEMS materials. BS IEC 62047-31 specifies a four-point bending test method for measuring interfacial adhesion energy of the weakest interface in the layered micro-electromechanical systems (MEMS) based on the concept of fracture mechanics. Who is BS IEC 62047 ‑

BS IEC 62047-31:2019 history
2019 BS IEC 62047-31:2019 Semiconductor devices. Micro-electromechanical devices - Four-point bending test method for interfacial adhesion energy of layered MEMS materials

BS IEC 62047-31:2019Semiconductor devices. Micro-electromechanical devices - Four-point bending test method for interfacial adhesion energy of layered MEMS materials

BS IEC 62047-31:2019 history

BS IEC 62047-31:2019
Semiconductor devices. Micro-electromechanical devices - Four-point bending test method for interfacial adhesion energy of layered MEMS materials