This document specifies the terms and definitions for film stress determination based on the substrate bending method, including: substrate, film, specimen, thickness, coating, physical vapor deposition technology, and radius of curvature. Measurement principle: Measure the curvature radius of the substrate before and after single-sided coating, the initial curvature radius of the substrate and the curvature radius of the substrate (coated surface), and calculate the film stress using the Stoney formula.
T/SZMES 3-2021 history
2021T/SZMES 3-2021 Determination of the film stress—Substrate curvature method