This document specifies the testing methods for microwave parameters of copper-clad laminates and printed circuit boards under high temperature, low temperature, temperature cycle, and humidity load, including general requirements, environmental test methods, insertion loss, characteristic impedance, dielectric constant and dielectric loss angle Tangent value, passive intermodulation test, etc. This document is suitable for testing microwave parameters of copper-clad laminates and printed circuit boards under environmental loads. Temperature test range:
——65℃~125℃, Humidity test range: 50%RH~95%RH, Temperature cycle rate: ≤15℃/ min.
T/CSTM 00989-2023 history
2023T/CSTM 00989-2023 Test method for microwave parameters under high temperature, low temperature, temperature cycling and humidity