IEC 60749-20-1:2019
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering

Standard No.

IEC 60749-20-1:2019

Release Date

2019

Published By

International Electrotechnical Commission (IEC)

Latest

IEC 60749-20-1:2019

IEC 60749-20-1:2019 history

• 0000 IEC 60749-20-1:2019 RLV
• 2009 IEC 60749-20-1:2009 Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat