DIN EN IEC 61189-2-809:2022-03
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-809: X/Y Coefficient of Thermal Expansion Test (CTE) for Thick Base Materials by TMA (IEC 91/1747/CD:2021); Text in German and English / N...

Standard No.
DIN EN IEC 61189-2-809:2022-03
Release Date
2022
Published By
German Institute for Standardization
Latest
DIN EN IEC 61189-2-809:2022-03

DIN EN IEC 61189-2-809:2022-03 history

  • 2022 DIN EN IEC 61189-2-809:2022-03 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-809: X/Y Coefficient of Thermal Expansion Test (CTE) for Thick Base Materials by TMA (IEC 91/1747/CD:2021); Text in German and English / N...
  • 2022 DIN EN IEC 61189-2-809:2022 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-809: X/Y Coefficient of Thermal Expansion Test (CTE) for Thick Base Materials by TMA (IEC 91/1747/CD:2021); Text in German and English

DIN EN IEC 61189-2-809:2022-03 -All Parts

DIN EN IEC 61189-5-301:2022-08 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles (IEC 61189-5-301:2021); German versi... DIN EN IEC 61189-5-501 E:2019-11 DIN EN IEC 61189-5-501:2022-08 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes (IEC 61189-5-501:20... DIN EN IEC 61189-5-502 E:2019-11 DIN EN IEC 61189-5-502:2022-05 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of assemblies (IEC 61189-5-502:2021);... DIN EN IEC 61189-5-504:2021-09 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT) (IEC 61189-5-504:2020); German version... DIN EN IEC 61189-5-601:2022-12 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test ...


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