EN IEC 61189-2-807:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA

Standard No.

EN IEC 61189-2-807:2021

Release Date

2021

Published By

European Committee for Electrotechnical Standardization（CENELEC）

Latest

EN IEC 61189-2-807:2021

Scope

IEC 61189-2-807:2021 specifies a test method to determine the decomposition temperature (Td) of base laminate materials using thermogravimetric analysis (TGA).

EN IEC 61189-2-807:2021 history

• 2021 EN IEC 61189-2-807:2021 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA