DB44/T 1555-2015
Interconnect Stress Test Method for High Density Printed Circuit Boards (English Version)

Standard No.

DB44/T 1555-2015

Language

Chinese, Available in English version

Release Date

2015

Published By

Guangdong Provincial Standard of the People's Republic of China

Latest

DB44/T 1555-2015

Scope

This standard specifies the plated hole interconnect stress test method for high-density interconnect printed circuit boards (HDI boards), including interconnect stress test coupon design requirements, test procedures and failure determination. This method is suitable for high-density interconnection printed circuit boards with six layers or more containing plated holes or micro-vias.

DB44/T 1555-2015 history

• 2015 DB44/T 1555-2015 Interconnect Stress Test Method for High Density Printed Circuit Boards