T/FSI 043-2019
Addition-type high thermal conductivity silicone potting compound for electronic appliances (English Version)

Standard No.
T/FSI 043-2019
Language
Chinese, Available in English version
Release Date
2019
Published By
Group Standards of the People's Republic of China
Latest
T/FSI 043-2019
Scope
This standard specifies the technical requirements, test methods, inspection rules, marking, packaging, transportation and storage of additive high thermal conductivity silicone potting compounds for electronic and electrical appliances. This standard applies to two-component addition type high thermal conductivity insulating liquid silicone rubber used in the electronic and electrical industry with a thermal conductivity of ≥1.5W/(m·K) and containing polysiloxane, fillers, etc. as the main components. Single-component also Can be used as a reference.

T/FSI 043-2019 history

  • 2019 T/FSI 043-2019 Addition-type high thermal conductivity silicone potting compound for electronic appliances



Copyright ©2024 All Rights Reserved