Form: This specification covers a two-compound@ an epoxy resin base and a hardener in the form of a paste. Application: Primarily for non-structural bonding of metallic alloys and thermosetting plastics to themselves and to each other. It is primarily intended as an adhesive for electrical components in devices operating at not higher than 120oC (250o F).
SAE AMS3691A-1986 history
1995SAE AMS3691C-1995 ADHESIVE COMPOUND@ EPOXY MEDIUM TEMPERATURE APPLICATION
1993SAE AMS3691B-1993 ADHESIVE COMPOUND, EPOXY Medium Temperature Application
1986SAE AMS3691A-1986 ADHESIVE COMPOUND@ EPOXY Medium Temperature Application (Reaffirmed)
1960SAE AMS3691-1960 ADHESIVE COMPOUND, EPOXY Medium Temperature Application