NF C93-732-807*NF EN IEC 61189-2-807:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807 : test methods for materials for interconnection structures - Decomposition temperature ( Td) using TGA

Standard No.

NF C93-732-807*NF EN IEC 61189-2-807:2021

Release Date

2021

Published By

Association Francaise de Normalisation

Latest

NF C93-732-807*NF EN IEC 61189-2-807:2021

NF C93-732-807*NF EN IEC 61189-2-807:2021 history

• 2021 NF C93-732-807*NF EN IEC 61189-2-807:2021 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807 : test methods for materials for interconnection structures - Decomposition temperature ( Td) using TGA