T/SHDSGY 051-2023
Low temperature curing single component conductive adhesive (English Version)

Standard No.

T/SHDSGY 051-2023

Language

Chinese, Available in English version

Release Date

2023

Published By

Group Standards of the People's Republic of China

Latest

T/SHDSGY 051-2023

Scope

This standard specifies the terms and definitions, requirements, test methods, inspection rules and signs, labels, instructions for use, packaging, transportation and storage of low-temperature curing single-component low-stress insulating adhesive. This standard applies to low-temperature curing one-component low-stress insulating adhesive.

T/SHDSGY 051-2023 history

• 2023 T/SHDSGY 051-2023 Low temperature curing single component conductive adhesive