GB/T 41852-2022 (English Version) PDF

Standard No.: GB/T 41852-2022
Language: Chinese, Available in English version
Release Date: 2022
Published By: General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China
Latest: GB/T 41852-2022

Scope: This document specifies a test method for the measurement of the bond strength between microscale elements and substrates using cylindrical specimens. This document is applicable to the bonding strength test of microstructures with width and thickness between 1 μm and 1 mm on the substrate. The micro-scale units of MEMS devices are composed of laminated fine film patterns produced on the substrate by processes such as deposition, electroplating, gluing, and photolithography. MEMS devices contain a large number of interfaces between different materials, which occasionally delaminate during fabrication or use. The bond strength is determined by the material bonding at the connection interface. In addition, the defects and residual stress near the interface will change with the change of process conditions, which greatly affects the bond strength. This document specifies the bonding strength test method for micro-sized units, in order to optimize the materials and process conditions of MEMS devices. Due to the wide range of materials and sizes that make up MEMS devices, and the instruments used to measure micro-sized units have not been fully promoted, this document does not make special restrictions on the materials, sizes and properties of the samples.

GB/T 41852-2022 Referenced Document

IEC 62047-2:2006 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials

2022 GB/T 41852-2022 Semiconductor devices—Micro-electromechanical devices—Bend-and shear-type test methods of measuring adhesive strength for MEMS structures