IEC 63011-2:2018
Integrated circuits - Three dimensional integrated circuits - Part 2: Alignment of stacked dies having fine pitch interconnect
- Standard No.
- IEC 63011-2:2018
- Release Date
- 2018
- Published By
- International Electrotechnical Commission (IEC)
- Latest
- IEC 63011-2:2018
IEC 63011-2:2018 history
- 2018 IEC 63011-2:2018 Integrated circuits - Three dimensional integrated circuits - Part 2: Alignment of stacked dies having fine pitch interconnect
