IEC TR 63378-1:2021
Thermal standardization on semiconductor packages - Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages

Standard No.

IEC TR 63378-1:2021

Release Date

2021

Published By

International Electrotechnical Commission (IEC)

Latest

IEC TR 63378-1:2021

IEC TR 63378-1:2021 history

• 2021 IEC TR 63378-1:2021 Thermal standardization on semiconductor packages - Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages