PD IEC TR 63378-1:2021
Thermal standardization on semiconductor packages. Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages
- Standard No.
- PD IEC TR 63378-1:2021
- Release Date
- 2022
- Published By
- British Standards Institution (BSI)
- Latest
- PD IEC TR 63378-1:2021
PD IEC TR 63378-1:2021 history
- 2022 PD IEC TR 63378-1:2021 Thermal standardization on semiconductor packages. Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages
