This document specifies test methods for coatings/platings used on high-speed printed boards, including test methods for thickness, roughness, solderability, characteristic impedance and insertion loss. This document is applicable to coatings/platings for high-speed printed boards, mainly including: organic solderability protective layer (hereinafter referred to as OSP), immersion tin, immersion silver, electroless nickel gold, electroless nickel palladium gold, electroplated nickel gold, etc., and other industries Surface coating/plating for printed boards can be used as a reference.
T/CSTM 00991-2023 history
2023T/CSTM 00991-2023 Test method of coating/plating for the high speed printed board