SJ/T 11273-2002
No-clean liquid soldering flux (English Version)
- Standard No.
- SJ/T 11273-2002
- Language
- Chinese, Available in English version
- Release Date
- 2002
- Published By
- Professional Standard - Electron
- Status
- 2016-09
- Replace By
- SJ/T 11273-2016
- Latest
- SJ/T 11273-2016
- Scope
- This standard specifies the technical requirements, test methods, inspection rules and product marking, packaging, transportation and storage of no-clean liquid flux for electronic welding. This standard applies to no-clean liquid flux for soldering of printed board assemblies and electrical and electronic circuit contacts. When using no-clean liquid flux, it is recommended to use matching pre-coating materials for welding printed circuit boards with pre-coated protective layers.
SJ/T 11273-2002 history
- 2016 SJ/T 11273-2016 No-clean liquid flux
- 2002 SJ/T 11273-2002 No-clean liquid soldering flux
