SJ/T 11319-2005
Quantity test method of the oxidation sludge in the tin solder (English Version)

Standard No.

SJ/T 11319-2005

Language

Chinese, Available in English version

Release Date

2005

Published By

Professional Standard - Electron

Latest

SJ/T 11319-2005

Scope

This standard specifies the test method for the oxidation slag yield of molten tin solder under dynamic conditions. This standard is applicable to the measurement of oxide slag yield of 60/40, 63/37 and other tin-lead alloy solders or lead-free solders.

SJ/T 11319-2005 history

• 2005 SJ/T 11319-2005 Quantity test method of the oxidation sludge in the tin solder