SJ 3232.2-1989
Test method for bonding residual stress of low-melting welding glass powder (English Version)
- Standard No.
- SJ 3232.2-1989
- Language
- Chinese, Available in English version
- Release Date
- 1989
- Published By
- Professional Standard - Electron
- Status
- 2005-09
- Replace By
- SJ/T 3231-2005
- Latest
- SJ/T 3231-2005
- Scope
- This standard applies to low-melting soldering glass powder for color picture tubes and other electronic devices.
SJ 3232.2-1989 history
- 2005 SJ/T 3231-2005 Frit glass powder
- 1989 SJ 3232.2-1989 Test method for bonding residual stress of low-melting welding glass powder
SJ 3232.2-1989 Test method for bonding residual stress of low-melting welding glass powder was changed to SJ/T 3231-2005 Frit glass powder.
