SJ/T 10626-1995
Method for determining impurities in gold wire for semiconductor lead bonding by ICP-AES (English Version)

Standard No.

SJ/T 10626-1995

Language

Chinese, Available in English version

Release Date

1995

Published By

Professional Standard - Electron

Latest

SJ/T 10626-1995

Scope

This standard is applicable to the determination of silver, copper, calcium, magnesium, manganese, iron, bismuth and lead elements in bonding gold wires. Its measurement range: lead and bismuth are 0.0008% to 0.0500%, and the rest are 0.0005 to 0.0500%.

SJ/T 10626-1995 history

• 1995 SJ/T 10626-1995 Method for determining impurities in gold wire for semiconductor lead bonding by ICP-AES